Within the framework of the Ukrainian Israeli Innovation Summit 2021, which will be dedicated to the 30th anniversary of the establishment of diplomatic relations between Ukraine and Israel, there will be discussions on the prospects of expanding cooperation and presentation of future technologies in construction and medicine. The Ambassador of Ukraine to the State of Israel Yevhen Korniychuk stated this at Facebook.

«I am pleased to announce that soon, on December 15, we will have a significant event - the fourth international conference Ukrainian Israeli Innovation Summit 2021. This year the event will be dedicated to the 30th anniversary of friendship and cooperation between Ukraine and Israel. It will bring together officials from Ukraine and Israel, representatives of leading technology companies, prominent scientists and public figures from both countries to discuss the prospects of expanding horizons for cooperation between the countries», - he said.

The head of the diplomatic mission noted that the conference participants will still focus on technological innovations.

«In particular, construction technologies and medicine - medical management of the future: Ukrainian-Israeli cooperation in healthcare technologies, a presentation of the most interesting technologies of the future. Prospects for business cooperation, venture investment and investment attraction, promotion of the country's brand in the international arena and the concept of «soft power» in women's leadership will also be discussed», - said Yevhen Korniychuk.

In addition, planned an award ceremony for prominent Israelis and Ukrainians who have made a significant contribution to the development of partnership between the countries «TOP-30 creators of Israeli-Ukrainian change».

The conference is organized by the Global Israeli Initiative technology platform, co-organized by the Embassy of Israel in Ukraine and the Embassy of Ukraine in Israel, UNIT.City Innovation Park, VentureIsrael Venture Fund, Simple Investing & Really Building and VIZHU.